We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Heat Control Products.
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Heat Control Products Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Heat Control Products Product List

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Heat management products - such as heat dissipation sheets and spacers -

Heat management products - such as heat dissipation sheets and spacers -

A wide range of products that support various heat sources such as CPUs, ICs, power ICs, and switching power supplies are available!

We would like to introduce our "thermal management products." Our lineup includes the "Thermostar TMS-14," which exhibits excellent thermal conductivity and high effectiveness, and the "Thermostar TMS-US18," which, due to its low hardness, accommodates a wide range of clearances and reduces the burden on the substrate. Additionally, we offer the "Thermostar/Soft Type for Thermal + Electromagnetic Wave Absorption" and the "Thermal Diffusion Sheet," which is suitable for thermal management in slim IT devices. 【Partial Lineup】 ■Thermostar TMS-14 ■Thermostar TMS-22 ■Thermostar TMS-43 ■Thermostar TMS-US18 ■Thermostar TMS-E14N *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Laird Technologies thermal management products

Laird Technologies thermal management products

Products are provided in a form that considers the customer's assembly workability! Soft materials reduce contact thermal resistance values.

We would like to introduce Laird Technologies' "thermal management products" that we handle. With our unique filler formulation technology, we reduce contact thermal resistance without compromising the high flexibility characteristic of silicone. Our soft materials with excellent thermal conductivity bring out high performance. We carry out cutting processes in forms that consider workability at our Shenzhen factory, and we provide product forms that take into account the assembly workability for our customers. 【Product Lineup (Partial)】 ■ Gap fillers ■ Grease ■ Graphite sheets ■ Peltier modules ■ Thermal conductive insulation sheets *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Other semiconductors

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Thermal management products "thermal filler" and "heat sink"

Thermal management products "thermal filler" and "heat sink"

Solving the issue of 'heat accumulation' and contributing to thermal management, such as MIL-spec heat sinks.

Our company manufactures and develops thermal management products such as the 'TMP-EX Heat Sink,' which achieves a thermal conductivity exceeding 1000 W/m·K in material property comparisons, and the BN filler 'PolarTherm,' which offers excellent thermal conductivity and low dielectric properties. We address the challenge of "heat buildup" to extend the lifespan of electronic components and printed circuit boards and contribute to stable operation of devices. Features of the 'TMP-EX Heat Sink': - Provided in a composite structure with a core material of thermal conductivity 1500 W/m·K and a capsule material with a thermal expansion rate suitable for semiconductor chips. - Passed tests in accordance with MIL-STD-883. Features of 'PolarTherm': - Provides high thermal conductivity through addition to polymer materials. - Thermal conductivity: 250–300 W/m·K, dielectric constant: 3.9. - Suitable for addition to rubber-based resins and engineering plastics. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Other electronic parts

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Heat management product "VSI"

Heat management product "VSI"

Releasing the "heat" with no escape! Introducing heat management for tightly sealed spaces with resin.

We would like to introduce the thermal management product "VSI" handled by Kato Tech. Thanks to the effect of infrared wavelength selective radiation from metamaterials, heat is released to the outside of the resin housing. This is a new heat dissipation method that selectively radiates infrared wavelengths. It excels in heat dissipation within resin-sealed spaces, suppressing the temperature of heat sources compared to traditional thermal conductive materials, and eliminating the occurrence of heat spots in the resin housing. 【Features】 ■ Significant heat dissipation effect in narrow spaces sealed with resin ■ A new heat dissipation method that selectively radiates infrared wavelengths (applying metamaterial technology) ■ Heat is released to the outside of the resin housing due to the effect of infrared wavelength selective radiation from metamaterials ■ Heat escapes to the outside of the resin housing, reducing the temperature of the heat source and eliminating heat spots *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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